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LifecyclePhase:
Revision : 4
Expired Period: Forever
Release Date:2013-05-06 14:02:32.0
DATASHEET
P-LED
32-01-T4C-4PRB
12
Copyright ? 2010, Everlight All Rights Reserved. Release Date : May.2. 2013 Issue No:   DPE-0000107
www.everlight.com
Notes
1.  Lead Forming
n    During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy
bulb.
n    Lead forming should be done before soldering.
n    Avoid stressing the LED package during leads forming. The stress to the base may damage the
LED s characteristics or it may break the LEDs.
n    Cut the LED leadframes at room temperature. Cutting the leadframes at high temperatures may
cause failure of the LEDs.
n    When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead
position of the LED. If the LEDs are mounted with stress at the leads, it causes deterioration of the
epoxy resin and this will degrade the LEDs.
2.  Storage
n    The LEDs should be stored at 30癈 or less and 70%RH or less after being shipped from Everlight
and the storage life limits are 3 months. If the LEDs are stored for 3 months or more, they can be
stored for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material.
n    Please avoid rapid transitions in ambient temperature, especially, in high humidity environments
where condensation can occur.
3.  Soldering
n    Careful attention should be paid during soldering. Solder the LED no lower than 1.6mm from the
base of stopper is recommended.
n    Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly
when soldering.
n    Recommended soldering conditions:
Hand Soldering
DIP Soldering
Temp. at tip of iron
300    Max. (30W Max.)
Preheat temp.
100    Max. (60 sec Max.)
Soldering time
3 sec Max.
Bath temp.
260 Max.
Distance
No lower than 1.6mm from
the base of stopper
Bath time.
5 sec Max.
Distance
No lower than 1.6mm from
the base of stopper
n    Dip and hand soldering should not be done more than one time
n    After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration
until the LEDs return to room temperature.
n    A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature.
n    Although the recommended soldering conditions are specified in the above table, dip or
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